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Effect of Cooling Cycle after Sintering on the Thermal Diffusivity of Y<sub>2</sub>O<sub>3</sub> Doped Si<sub>3</sub>N<sub>4</sub> Ceramics

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dc.contributor.authorTuran, Servet
dc.contributor.authorServet Turan
dc.contributor.orcid0000-0003-0411-9773
dc.contributor.orcid0000-0002-7322-3091
dc.date.accessioned2025-11-13T11:54:17Z
dc.date.issued2018-01-01
dc.identifier.doihttps://doi.org/10.13189/ujms.2018.060105
dc.identifier.endpage47
dc.identifier.issn2331-6691
dc.identifier.issue1
dc.identifier.openalexW2796959886
dc.identifier.startpage39
dc.identifier.urihttps://hdl.handle.net/11421/8331
dc.identifier.urihttps://doi.org/10.13189/ujms.2018.060105
dc.identifier.volume6
dc.language.isoen
dc.relation.ispartofUniversal Journal of Materials Science
dc.rightsopenAccess
dc.subjectSintering
dc.subjectThermal diffusivity
dc.subjectMaterials science
dc.subjectDoping
dc.subjectMetallurgy
dc.subjectThermodynamics
dc.subjectPhysics
dc.subject.sdg7
dc.titleEffect of Cooling Cycle after Sintering on the Thermal Diffusivity of Y<sub>2</sub>O<sub>3</sub> Doped Si<sub>3</sub>N<sub>4</sub> Ceramics
dc.typeArticle
dspace.entity.typePublication
local.authorid.openalexA5045143436

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