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Micro-Structural Characterization of the bond strength capacity of adhesive material in the alternative of cold-formed steel frame system

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dc.contributor.authorTaşkın, Kıvanç
dc.contributor.authorEndah Wahyuni
dc.contributor.authorPriyo Suprobo
dc.contributor.authorKıvanç Taşkın
dc.contributor.orcid0000-0001-7260-0855
dc.contributor.orcid0000-0001-8056-7020
dc.contributor.orcid0000-0003-2521-2280
dc.contributor.orcid0000-0001-8024-4600
dc.date.accessioned2025-11-13T11:27:30Z
dc.date.issued2019-01-08
dc.identifier.doihttps://doi.org/10.1088/1757-899x/462/1/012004
dc.identifier.endpage012004
dc.identifier.issn1757-8981
dc.identifier.openalexW2909240580
dc.identifier.startpage012004
dc.identifier.urihttps://hdl.handle.net/11421/6858
dc.identifier.urihttps://doi.org/10.1088/1757-899x/462/1/012004
dc.identifier.volume462
dc.language.isoen
dc.relation.ispartofIOP Conference Series Materials Science and Engineering
dc.rightsopenAccess
dc.subjectMaterials science
dc.subjectScanning electron microscope
dc.subjectAdhesive
dc.subjectComposite material
dc.subjectCharacterization (materials science)
dc.subjectStructural material
dc.subjectBond strength
dc.subjectLayer (electronics)
dc.subjectNanotechnology
dc.titleMicro-Structural Characterization of the bond strength capacity of adhesive material in the alternative of cold-formed steel frame system
dc.typeArticle
dspace.entity.typePublication
local.authorid.openalexA5047650796

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